VIA Launches Ruggedized VIA AMOS-3007 Intelligent Edge System for the Most
Demanding Industrial IoT Deployments
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VIA Technologies, Inc. today announced the launch of the ruggedized VIA
AMOS-3007 Intelligent Edge System for the most demanding Industrial IoT use
cases...
Wednesday, January 19, 2011
Compal ODM ARM plans
VIA has worked with Compal in the past, supplying processors and chips for ODM netbook and notebooks. DigitTimes has revealed that Compal hopes to bounce back from a loss in 2010 by supplying ARM-based ODM tablets PCs. If the business and project managers at VIA, and/or their subsidiary WonderMedia, are working hard then this could involve VIA ... 'tis all I'm saying!
Labels:
Compal,
WonderMedia
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