Friday, June 11, 2010
VIA netbook and notebooks still strong in Asia
Wednesday, April 28, 2010
Excellent article about new Nano processor range
According to LinuxFor Devices.com, the new SKUs of the VIA Nano processors have a mobile design purpose:
"Via's new Nano E series processors are, as in the past, available in an L-series ("low-power") for mainstream desktop and mobile PC systems, and in a U-series ("ultra-low-power") for mini-notebooks and small form factor devices. They use the same 21mm x 21mm nanoBGA2 package as the original Nano, and once again are being manufactured -- likely by Fujitsu -- using a 65nm process. "
The five new processors have a very low power draw, in fact, according to VIA, they're 20% faster but 20% more power efficient than previous VIA Nano processors.
800MHz U3400, with 100mW idle power
1.0GHz U3500, with 100mW idle power
1.2GHz U3300, with 100mW idle power
1.3+GHz U3100, with 100mW idle power
1.8GHz L3050, with 500mW idle power
Tuesday, April 13, 2010
Now you can get 10 inches for $100
Monday, April 12, 2010
Two big hitters to use VX900 in upcoming netbooks
OLPC orders see VIA revenue increase by over 50% from Feb to Mar
Friday, March 26, 2010
VX900: Blu-ray, PCI Express, dual monitors ...
While the VX855 supported CRT, LVDS and TTL monitors, the new VX900 supports HDMI as well. Furthermore "DuoView support allows multi-monitor extended desktop support where two independent display engines can display different content at different resolutions, pixel depths and refresh rates."
There is also a lot of upgrade capability with this new chip since it offers a PCI Express 2.0 interface with 1 8 lane and 3 single lane slots. There's also two PCI slots and an 8 channel HD audio codec.
This is a very feature rich, flexible single chip solution. ''The VIA VX900 MSP supports the latest DDR3 system memory at speeds of up to 1066MHz and is compatible with the VIA Nano™, VIA C7® and VIA Eden™ processor families. The VIA VX900 integrates all the features of a traditional North and South bridge solution into a 31mm x 31mm single chip package, offering a reduced overall silicon footprint compared with competing twin-chip core logic implementations."